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IC Package/System Design solution Engineer, Staff

June 1, 2026

Company Qualcomm Technologies, Inc. Job Area Engineering Group, Engineering Group > Packaging Engineering General Summary CHS (Central Hardware Systems) Architecture and Design team at Qualcomm is looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work! By joining our team, you’ll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on designing XR packages and systems based on Qualcomm's Snapdragon SoC. As an experienced CHS-AAD Engineer (individual contributor), you will collaborate with various cross-functional teams, including Technology team, SIPI, PDN, PCB design team, product management, and Chipset team. You will be responsible for creating high-performance package/SIPs designs and ensuring their successful transition to production for our XR products <ul><li>Position requires to be in San Diego full time, 5 days a week </li></ul>Key Responsibilities <ul><li>IC top level floorplanning and understanding of hard macro block placement, padring, RDL and bump pattern/assignment.</li><li>System level co-design methodology of IC, Package and PCB/Board.</li><li>Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost.</li><li>Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs.</li><li>Experience with ORCAD schematic and Allegro design tools.</li><li>Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels.</li><li>Understanding on PMIC and its eBOM.</li><li>Designing PDN from PMIC to SOC to meet the given targets.</li><li>Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products</li><li>Designing High speed interfaces.</li><li>Verification for packages and sips using Valor and ravel checks.</li><li>Design review with suppliers and Osats.</li><li>Evaluations on optimizing cost and area for a given package/SIP structure. </li></ul>Qualifications <ul><li>Master's degree in Electrical or Computer Engineering or a related field.</li><li>7+ years of experience in package/SIP/PCB hardware design.</li><li>Expertise designing high-speed, dense, multi-layer Packages, PCBs and systems.</li><li>Proficiency in logic design, schematic capture, board layout tools, and testing.</li><li>Strong knowledge of SIPI, PDN, thermal management, and compliance testing.</li><li>Expertise in high-speed analog and digital design.</li><li>Hands-on experience with PCIe, DDR, Ethernet, SerDes, and communication protocols (I2C/I3C/SPI/MDIO).</li><li>Proven ability to work independently and collaboratively within a cross-functional team environment.</li><li>Strong technical documentation skills and excellent written and verbal communication. </li></ul>Preferred Qualifications <ul><li>PhD degree in Electrical or Computer Engineering or a related field.</li><li>5+ years of experience in package/PCB design.</li><li>In-depth knowledge of PMIC, RF front end, Memories</li><li>Working knowledge with scripting languages (Python, PERL, TCL). </li></ul>Ideal Candidate Will Have <ul><li> Bachelor's degree in Electrical Engineering, Computer Science, or related field and 9+ years of Systems Engineering or related work experience. </li></ul>OR Master's degree in Electrical Engineering, Computer Science, or related field and 7+ years of Systems Engineering or related work experience. OR PhD in Electrical Engineering, Computer Science, or related field and 5+ years of Systems Engineering or related work experience. Minimum Qualifications <ul><li> Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience. </li></ul>OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay Range And Other Compensation & Benefits $154,000.00 - $231,000.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link. If you would like more information about this role, please contact Qualcomm Careers.

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Common Interview Questions And Answers

1. HOW DO YOU PLAN YOUR DAY?

This is what this question poses: When do you focus and start working seriously? What are the hours you work optimally? Are you a night owl? A morning bird? Remote teams can be made up of people working on different shifts and around the world, so you won't necessarily be stuck in the 9-5 schedule if it's not for you...

2. HOW DO YOU USE THE DIFFERENT COMMUNICATION TOOLS IN DIFFERENT SITUATIONS?

When you're working on a remote team, there's no way to chat in the hallway between meetings or catch up on the latest project during an office carpool. Therefore, virtual communication will be absolutely essential to get your work done...

3. WHAT IS "WORKING REMOTE" REALLY FOR YOU?

Many people want to work remotely because of the flexibility it allows. You can work anywhere and at any time of the day...

4. WHAT DO YOU NEED IN YOUR PHYSICAL WORKSPACE TO SUCCEED IN YOUR WORK?

With this question, companies are looking to see what equipment they may need to provide you with and to verify how aware you are of what remote working could mean for you physically and logistically...

5. HOW DO YOU PROCESS INFORMATION?

Several years ago, I was working in a team to plan a big event. My supervisor made us all work as a team before the big day. One of our activities has been to find out how each of us processes information...

6. HOW DO YOU MANAGE THE CALENDAR AND THE PROGRAM? WHICH APPLICATIONS / SYSTEM DO YOU USE?

Or you may receive even more specific questions, such as: What's on your calendar? Do you plan blocks of time to do certain types of work? Do you have an open calendar that everyone can see?...

7. HOW DO YOU ORGANIZE FILES, LINKS, AND TABS ON YOUR COMPUTER?

Just like your schedule, how you track files and other information is very important. After all, everything is digital!...

8. HOW TO PRIORITIZE WORK?

The day I watched Marie Forleo's film separating the important from the urgent, my life changed. Not all remote jobs start fast, but most of them are...

9. HOW DO YOU PREPARE FOR A MEETING AND PREPARE A MEETING? WHAT DO YOU SEE HAPPENING DURING THE MEETING?

Just as communication is essential when working remotely, so is organization. Because you won't have those opportunities in the elevator or a casual conversation in the lunchroom, you should take advantage of the little time you have in a video or phone conference...

10. HOW DO YOU USE TECHNOLOGY ON A DAILY BASIS, IN YOUR WORK AND FOR YOUR PLEASURE?

This is a great question because it shows your comfort level with technology, which is very important for a remote worker because you will be working with technology over time...

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